Ellington Capability

Capability
Process & CPK value
Process & CPK Value
Process
Control Characteristic
CPK Value
Drilling
Hole Position Deviation/Hole Roughness
≥1.67 or According to customer’s request
Pattern Plating
Copper thickness in hole
Outer Etching
Line Width &Spacing / Impedance
Solder Mask
Line Width &Spacing / Impedance
Profiling
Outline Deviation(Routing)
OSP
Coating Thickness
IMAG ( Immersion Silver )
Ag Thickness
IMSN ( Immersion Tin )
Tin Thickness
ENIG( Immersion Gold )
Au Thickness